About this item

It is recommended to use with a first-line brand motherboard, which can enhance the stability of the product.Selected chips to ensure maximum stability at this frequency. If you are looking for extreme overclocking, please choose M-die chips with other frequencies.

XMP 3.0/EXPO:Cross-platform compatibility, stable base frequency, overclocking to 6000MHz requires slots 2-4 (limited to overclocking motherboards).

Efficient heat dissipation: Equipped with thick alloy radiator, excellent thermal conductivity design, improves heat dissipation efficiency, and helps performance.

High-quality craftsmanship: Multi-layer PCB boards, layer-by-layer compatibility testing to ensure reliable and stable performance.

Boosted Performance: Experience a significant increase in bandwidth and enjoy improved overall performance. Whether you're engaging in intense game competitions or working on graphic design projects, this memory provides high efficiency.

Please update the BIOS to the latest version to ensure smooth operation of the device. At the same time, we provide a full range of customer services and quality control to ensure the performance and quality of the product.

Disclaimer: Maximum Speed requires overclocking/PC BIOS adjustments. Maximum speed and performance depend on system components, including motherboard and CPU

Notice:

Please try contacting customer service before submitting any dispute; customer service will do their best to help you resolve the issue.

If you are unsure whether this product is suitable for your computer, please contact customer service and provide your motherboard and CPU models. Customer service will provide the answer.

AMD CPUs have weak overclocking capabilities; we recommend choosing 6000MHz for the most stable frequency.

KINGBANK KJXS DDR5 SILVER HEATSINK SERIES

KingBank KJXS DDR5 Silver heatsink Series can run up to 6000MT/s. Each 288-pin DIMM has gold contact fingers neatly lined in the multi-layer PCB board and armored with a metal heatsink. The memory modules feature effective heat dissipation and stable high-speed performance.

Features

Multiple frequencies available: 6000MT/s

Multiple capacities available: 8GB / 16GB(8GB*2)

Metal heatsink armored: stable heat dissipation

DDR5 memory module with PMIC and on-die ECC

Compatible with Intel®/AMD and other platforms; plug and play

DDR5 memory module supports Intel® XMP 3.0/AMD EXPO overclocking

Specifications

Module Type:DDR5 U-DIMM

Standard JEDEC®:Speed 6000MT/s

Capacity:8GB / 16GB(8GB*2)

Operating Temperature:0°C ~ 85°C

Wide Temperature: -40°C~ 85°C

Dimensions(L × W × H):136×38 ×6mm(with heatsink)

Warranty:Limited Lifetime Warranty

Chip：Hynix

8GB 6000MHz------------CL36-36-36-80